| Вендор |
ASUS
|
| Код виробника |
TUF GAMING B860M-PLUS WIFI
|
| Гарантія (міс.) |
36
|
| Сокет |
Socket 1851
|
| Підтримка процесорів |
Support Intel® Core™ Ultra Processors (Series 2) ,LGA1851*
Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0**
*Refer to https://www.asus.com/support/download-center/ for CPU support list.
**Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types
|
| Чіпсет |
Intel B860
|
| Пам'ять |
DDR5
|
| Підтримка пам'яті |
4 x DIMM slots, max. 256GB, DDR5
Support up to 8800+MT/s (OC), Non-ECC,Un-buffered ,Clocked Unbuffered DIMM (CUDIMM)*
Dual Channel Memory Architecture
DIMM Fit
Supports Intel® Extreme Memory Profile (XMP) memory module
ASUS Enhanced Memory Profile III(AEMPIII)
* Supported memory types, data rate (speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information please refer to CPU/Memory Support list under the Support tab of product information site or visit https://www.asus.com/support/download-center/. Adjustments will be made based on the specifications of mass-produced memory products available on the market.
* Non-ECC, un-buffered DDR5 memory supports On-Die ECC function
|
| Слоти розширення |
Intel® CoreTM Ultra Processors(Series 2)*
1 x PCIe 5.0 x16 slot
Intel® B860 Chipset
1 x PCIe 4.0 x4 slot
– To ensure compatibility of the device installed, please refer to https://www.asus.com/support/ for the list of supported peripherals
|
| Накопичувач |
Supports 3 x M.2 slots and 4 x SATA 6Gb/s ports*
Intel® Core™ Ultra Processors(Series 2)*
M.2_1 slot (Key M), type 2280 (supports PCIe 5.0 x4 mode)
Intel® B860 Chipset
M.2_2 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode)
M.2_3 slot (Key M), type 2280 (supports PCIe 4.0 x4 mode)
4 x SATA 6Gb/s ports
*Intel® Rapid Storage Technology supports SATA RAID 0/1/5/10
|
| LAN |
1 x Realtek 2.5Gb Ethernet
TUF LANGuard
|
| Бездротові інтерфейси |
Wi-Fi 7*
2×2 Wi-Fi 7 (802.11be)
Supports 2.4/5/6GHz frequency band**
Supports Wi-Fi 7 160MHz bandwidth, up to 2.9Gbps transfer rate.
Bluetooth® v5.4***
*Wi-Fi features may vary depending on the operating system
For Windows 11, Wi-Fi 7 will require 24H2 or later version for full functions, Windows 11 21H2/22H2/23H2 only support Wi-Fi 6E.
** Wi-Fi 6GHz frequency band and bandwidth regulatory may vary between countries.
*** The Bluetooth® version may vary, please refer to the Wi-Fi module manufacturer's website for the latest specifications
|
| Аудіо |
Realtek 7.1 Surround Sound High Definition Audio CODEC
– Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking
– Supports up to 24-Bit/192 kHz playback
Audio Features
– Audio Shielding
– Rear optical S/PDIF out port
– Premium audio capacitors
– Dedicated audio PCB layers
|
| Порти на задній панелі |
1 x USB 20Gbps port (1 x USB Type-C® with DP Alt mode)
2 x USB 10Gbps port (2 x Type-A)
4 x USB 5Gbps ports (4 x Type-A)
1 x USB 2.0 port (1 x Type-A)
1 x DisplayPort
1 x HDMI™ port
1 x Wi-Fi Module
1 x Realtek 2.5Gb Ethernet port
5 x Audio jacks
1 x Optical S/PDIF out port
|
| Внутрішні роз'єми |
1 x 4-pin CPU Fan header
1 x 4-pin CPU OPT Fan header
1 x 4-pin AIO Pump header
3 x 4-pin Chassis Fan headers
1 x 24-pin Main Power connector
2 x 8-pin +12V Power connectors
Storage related
3 x M.2 slots (Key M)
4 x SATA 6Gb/s ports
1 x USB 10Gbps connector (supports USB Type-C® )
1 x USB 5Gbps header supports 2 additional USB 5Gbps ports
1 x USB 2.0 header supports 2 additional USB 2.0 ports
3 x Addressable Gen 2 headers
1 x Clear CMOS header
1 x Chassis Intrusion header
1 x Front panel audio header (F_AUDIO)
1 x 10-1 pin Front System Panel header
1 x Thunderbolt™ (USB4®) header
|
| BIOS |
2 x 128 Mb Flash ROM, UEFI AMI BIOS
|
| Підтримка ОС |
Windows 11 (22H2 & later)
|
| Форм-фактор |
MicroATX
|
| Габарити |
9.6 inch x 9.6 inch ( 24.4 cm x 24.4 cm )
|
| * |
Характеристики та комплектація товару можуть змінюватися виробником без попередження.
|
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